The China Post
Date: April 14, 2017
By: Christine Choum
Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電), the world’s largest contract
Taiwan Semiconductor Manufacturing Co. Co-CEO Mark Liu (劉德音), left, and Senior Vice President Lora Ho (何麗梅) speaking at the chipmaker’s shareholder meeting in Taipei on Thursday, April 13. (Christine Chou, The China Post)
chipmaker, said Thursday it was still location-hunting for its NT$500 billion 3-nanometer (nm) chip fab.
At a shareholder meeting, TSMC Co-CEO C.C. Wei (魏哲家) said the company was still considering all possibilities but added that setting up the fab in the U.S. was “still not a very optimal option.”
Wei was addressing news reports that the company had been considering building its most advanced plant yet in the U.S. rather than in Taiwan — a rumor that sent government officials scrambling for verification.
Technology Minister Chen Liang-gee (陳良基) later denied the report, saying TSMC management told him there were no plans to build the plant in the U.S. [FULL STORY]
