The China Post
Date: March 4, 2017
By: CNA
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電), the world’s largest contract chip
The logo of the Taiwan Semiconductor Manufacturing Co. is seen in this photo taken in Hsinchu on Feb. 23. (Christine Chou, The China Post)
maker, is expected to have the third largest capital expenditure in the global integrated circuit (IC) industry in 2017, according to US-based advisory IC Insights.
In a research note, posted on its website on Thursday, IC Insights said that TSMC is expected to assign US$10 billion in capex for 2017, trailing only South Korea-based Samsung Electronics Co’s forecast US$12.5 billion and U.S-based Intel Corp’s estimated US$12 billion.
The research showed that TSMC’s capex for 2017 will be about 2 percent lower than the US$10.25 billion spent in 2016, which was up 27 percent from a year earlier.
In late February, Mark Liu (劉德音), TSMC’s president and co-chief executive officer, told the company’s annual supplier forum that the chip maker will focus on high-end technology development, including sophisticated 7, 5 and even 3 nanometer processes this year, in a bid to maintain its lead over competitors. [FULL STORY]
