The China Post
Date: July 8, 2016
By: CNA
SHANGHAI — Ground was broken Thursday for a new 12-inch wafer plant of Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電), the world’s largest contract chip-maker, in Nanjing, Jiangsu province, with commercial production of the new site scheduled to start in the second half of 2018.
TSMC Chairman Morris Chang (張忠謀) attended the ground-breaking ceremony to observe the new milestone in the development of Taiwan’s semiconductor industry in its global expansion strategies.
Several high-ranking mainland authorities and Chinese Communist Party (CCP) officials, including Jiangsu province CCP secretary Li Qiang, also attended the ground-breaking.
The new TSMC facility will be the third 12-inch wafer plant built by a Taiwanese chip-maker in China after the two others, operated by the second-largest Taiwanese chip-maker United Microelectronics Corp. (聯電) and memory chip supplier Powerchip Technology Corp. (力晶科技). [FULL STORY]