One plant is expected to come online in second half of 2021, second plant will be operational in 2022
By: Eric Chang, Taiwan News
According to a TSMC blog post, as workloads for semiconductors have evolved, packing technologies have become increasingly important, and can be critical to a product’s performance, function, and cost. In many cases, making a large monolithic chip using the most advanced processes is not optimal, which is where packaging technologies come into play.
TSMC has several advanced 2.5D packaging and 3D silicon stacking technologies it calls 3DFabric, according to Tom’s Hardware. “TSMC’s logic-on-logic stacking CoW (chip-on-wafer) and WoW (wafer-on-wafer) technologies require advanced frontend production facilities, whereas interposed-based packaging processes like CoWoS (chip-on-wafer-on-substrate) and package-on-package interconnects like InFO (integrated fan-out) use backend fab technologies,” the report said.
TSMC currently has four advanced packaging facilities in Taoyuan, Hsinchu, Taichung, and Tainan. According to Digitimes, TSMC is expecting demand for its 3DFabric services to remain strong in the coming years, so it is planning on building two more packaging facilities.