BOOKED: The firm said its factories are fully utilized even after the merger with SPIL, which means concerns that the merger would undermine demand were unfounded
Taipei Times
Date: Apr 04, 2018
By: Lisa Wang / Staff reporter, in KAOHSIUNG
Advanced Semiconductor Engineering Inc (ASE, 日月光半導體) yesterday said it is
investing NT$12.5 billion (US$429 million) on a new advanced fab in Kaohsiung to expand capacity, with the aim of keeping up pace with high demand for system-in-a-package (SiP) services.
The rapid proliferation of slim Internet of Things devices is driving demand for SiP packaging technology, which encloses several chips, such as microprocessors and memory chips, in a single module, the world’s largest chip tester and packager said.
“Our factories are fully utilized [even] after the consolidation of ASE and Siliconware Precision Industries Co (SPIL, 矽品精密),” ASE chairman Jason Chang (張虔生) told a media gathering.
“This proves that the concern that the combination of the two firms would undermine ASE’s customer base and reduce client orders is unfounded,” Chang said
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