GROWTH POTENTIAL: The new venture would build a facility in Sao Paulo to develop, design and produce system-in-a-package modules used in IoT devices and smartphones

Taipei Times
Date: Feb 07, 2018
By: Lisa Wang  /  Staff reporter

Advanced Semiconductor Engineering Inc (ASE, 日月光半導體), the world’s biggest chip tester and packager, yesterday said that it plans to invest US$70.5 million in a joint venture with Qualcomm Inc to develop and produce system-in-a-package (SiP) modules in Brazil.

The modules would be used in Internet of Things (IoT) devices and smartphones, ASE said in a company filing with the Taiwan Stock Exchange.

The investment will be made in three stages via its Shanghai-based subsidiary, Universal Scientific Industrial (Shanghai) Co Ltd (USI, 環旭電子), ASE said in the filing.

In a joint statement released yesterday, Qualcomm said its fully owned subsidiary, Qualcomm Technologies Inc, has signed an agreement with USI to form the joint venture.
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