Intel to issue bonds in Taiwan in August

Focus Taiwan
Date: 2015/07/30
By: Han Ting-ting and Frances Huang

Taipei, July 30 (CNA) Intel Corp., the world’s largest chip maker, will issue bonds in Taiwan in 201507300020t0001a bid to finance an acquisition of U.S.-based programmable logic semiconductor supplier Altera, the Taipei Exchange (TPEx) said Thursday.

The TPEx, which runs the local bond trading platform, said that Intel is scheduled to issue US$1.007 billion or about NT$30 billion worth of bonds on Aug. 11.

After the Intel bond sale news surfaced in the local media Thursday morning, Lee Chi-hsien (李啟賢), president of the TPEx, confirmed that the U.S. chip giant is expected to file its application with the exchange for the bond sale soon.

According to the TPEx, the Intel bond sale will be the third largest bond sale denominated in U.S. dollars in Taiwan, only trailing U.S.-based telecom operator AT&T’s two previous bond sale deals here.     [FULL  STORY]

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