‘RECOVERY PLAN’:The company is developing a cost-effective modem architecture to go with its mid-range mobile phone chips, CEO Tsai Ming-kai told a media briefing
Date: Jun 16, 2017
By: Lisa Wang / Staff reporter, in Hsinchu
MediaTek Inc (聯發科) yesterday said it is seeking to recoup its market position in the next one to two
years by improving its handset chip’s cost structure and increasing its penetration into telecoms beyond China by tapping into new co-chief executive officer Rick Tsai’s (蔡力行) semiconductor experience.
The world’s No. 3 chip designer last year suffered a setback in terms of market share and gross margin, which it attributed to a host of factors, including chip supply constraints, key component price hikes and product planning flaws.
Unveiling its “recovery plan,” MediaTek chairman and co-chief executive officer Tsai Ming-kai (蔡明介) told a media briefing in Hsinchu that the company is developing a new cost-effective modem architecture to go with its mid-range mobile phone chips, dubbed Helio P series, and entry-level 4G chips.
The new modem architecture is scheduled to hit the market in the second half of this year, which is expected to significantly improve the firm’s chip cost structure, Tsai Ming-kai said. [FULL STORY]