STAYING IN TAIWAN: The firm said it is preparing for a share relaunch in 2020 to fund the construction of the new fabs and would also seek financing sources from banks

Taipei Times
Date: Aug 28, 2018
By: Lisa Wang  /  Staff reporter

Contract chipmaker Powerchip Technology Corp (力晶科技) yesterday finalized a NT$278 billion (US$9.03 billion) investment in new fabs, and aims to produce its first 28-nanometer chips in 2022 to tap into new markets such as genetic testing for diseases and emerging memory chips.

The figure is the third-highest in a spate of investments among the nation’s semiconductor companies, following Taiwan Semiconductor Manufacturing Co’s (TSMC, 台積電) NT$600 billion outlay and Winbond Electronics Co’s (華邦電子) NT$335 billion investment earlier this year.

Powerchip, which is not listed on the local bourse, plans to build two new 12-inch plants at the Tongluo Industrial Park (銅鑼科學園區) in Miaoli County with a combined capacity of 100,000 wafers a month, leveraging the nation’s extensive semiconductor supply chain.

The investment would create 2,700 jobs, the company said in a statement.
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