Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chipmaker, said on Feb. 26 that it is planning to build a research and development center in Hsinchu Science Park, according to Taiwan’s Ministry of Economic Affairs

Taiwan News 
Date: 2018/03/04
By: George Liao, Taiwan News, Staff Writer

TAIPEI (Taiwan News)–Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s

largest contract chipmaker, said on Feb. 26 that it is planning to build a research and development center in Hsinchu Science Park, according to Taiwan’s Ministry of Economic Affairs citing other news sources.

The application for the establishment of the new R&D center has recently been approved by the Ministry of Science and Technology pending an environmental impact assessment, the MOEA said in a news release on Friday.

Construction of the R&D center, which will cover about 30 hectares near the company’s headquarters, will begin at the end of 2019 and is expected to be completed by 2021, according to the release. The cost of the project has been estimated by local media at roughly NT$100 billion (US$3.42 billion), the release said.

Meanwhile, TSMC is working on putting 7nm, 5nm and 3nm processes into production. Currently, the company’s most advanced technology in commercial production is the 10nm process.     [FULL  STORY]