Date: February 4, 2016
An investment plan by Taiwan Semiconductor Manufacturing Co.
Ltd. for a 12-inch wafer fab and design center in the mainland Chinese city of Nanjing was greenlighted Feb. 3 by the ROC Ministry of Economic Affairs.
Boasting a capacity of 20,000 wafers per month, the wholly owned facility is set to begin mass production using 16 nanometer process technology in the second half of 2018. At the same time, the center will help TSMC build its own design ecosystem on the other side of the strait.
TSMC Chairman Morris Chang said in view of the rapid growth of the mainland Chinese semiconductor market, the plan enables the company to provide closer support for its customers and tap further business opportunities. [FULL STORY]