TSMC to issue additional NT$18.5 billion in corporate bonds

Focus Taiwan
Date: 12/19/20201
By: Chang Chein-chung,
Jeffrey Wu and Frances Huang

CNA photo Dec. 19, 2020

Taipei, Dec. 19 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, will issue an additional NT$18.5 billion (US$649 million) in bonds to raise funds to increase capacity.

TSMC's board approved a plan Friday to issue NT$18.5 billion in unsecured straight corporate bonds in three tranches.

There will be a five-year NT$1.9 billion tranche with a coupon rate of 0.36 percent, a seven-year NT$10.2 billion tranche at 0.41 percent, and a 10-year NT$6.4 billion tranche at 0.45 percent.

The chipmaker said KGI Securities will serve as the lead underwriter for the bond sale.

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