By: Chang Chein-chung,
Jeffrey Wu and Frances Huang
TSMC's board approved a plan Friday to issue NT$18.5 billion in unsecured straight corporate bonds in three tranches.
There will be a five-year NT$1.9 billion tranche with a coupon rate of 0.36 percent, a seven-year NT$10.2 billion tranche at 0.41 percent, and a 10-year NT$6.4 billion tranche at 0.45 percent.
The chipmaker said KGI Securities will serve as the lead underwriter for the bond sale.