Focus Taiwan
Date: 05/20/2020
By: Chang Chien-chung, Han Ting-ting and Frances Huang
Taipei, May 20 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contact chipmaker, said it will issue NT$14.4 billion (US$482 million) in unsecured straight bonds to meet fund demands for new factory construction and the installation of production equipment.
In a statement, TSMC said the NT$14.4 billion straight bonds will be comprised of three tranches: NT$4.5 billion with a maturity of five years, NT$7.5 billion at seven years and NT$2.4 billion at 10 years.
TSMC said the three tranches will carry a rate of 0.55 percent, 0.6 percent, and 0.64 percent, respectively, with Hua Nan Securities serving as the underwriter.
It will be the third bond issuance by TSMC this year after NT$24 billion and NT$21.6 billion in unsecured straight bonds were sold in May and April, respectively. [FULL STORY]
