TSMC’s 5nm wafer foundry to break ground on Jan. 26

Focus Taiwan
Date: 2018/01/19
By: Chang Chien-chung and Frances Huan

Taipei, Jan. 19 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s

CNA file photo

largest contract chipmaker, said Friday that it is scheduled to break ground for a new foundry to produce the advanced 5 nanometer wafer in the Southern Taiwan Science Park on Jan. 26.

TSMC said it issued invitations on Friday to its guests to attend the ground-breaking ceremony, which will be presided over by its Chairman Morris Chang (張忠謀).

In November, TSMC’s board meeting approved a capital appropriation plan of US$4.28 billion and out of the budget, about US$1.67 billion will be used for construction of the 5nm plant in Tainan City.

The chipmaker has not yet disclosed the total investment for the new 5nm plant. Market analysts have anticipated Chang will give more details about the financial terms of the new plant at the ceremony.    [FULL  STORY]

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