TSMC to break ground on R&D center next year: chairman

Focus Taiwan
Date: 2019/11/01
By: Chang Chien-chung and Ko Lin

Taipei, Nov. 1 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, is expected to break ground on a new research and development center in Hsinchu next year.

At an annual convention organized by the Taiwan Semiconductor Industry Association (TSIA) Thursday, TSMC Chairman Mark Liu (劉德音) described the center as Taiwan's equivalent to Bell Labs, a globally renowned R&D institution that has been established in the United States for over 90 years.

The R&D center will be built in the Hsinchu Science Park over some 32 hectares and has already passed a city government environmental impact assessment in July this year.

The site has the capacity to house some 8,000 researchers, who will help spearhead TSMC's research for the next 20 to 30 years, Liu said.    [FULL  STORY]

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