TSMC to issue NT$13.9 billion in bonds to fund production expansion

Focus Taiwan
Date: 07/04/2020
By: Chang Chien-chung and Frances Huang

CNA file photo

Taipei, July 4 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, will issue NT$13.9 billion (US$470 million) in unsecured bonds soon to help fund its plan to expand production capacity.

In a filing on the Taiwan Stock Exchange (TWSE) Friday, TSMC said the bonds will comprise three tranches — NT$5.7 billion payable over 5 years, NT$6.3 billion over 7 years, and NT$1.9 billion over 10 years.

The interest rates will be 0.58 percent on the five-year bonds, 0.65 percent on the seven-year ones, and 0.67 percent on the 10 year tranche, TSMC said.

Capital Securities will serve as the main underwriter in the bond sale, TSMC said, but did not disclose when exactly the bonds will be issued.    [FULL  STORY]

Leave a Reply

Your email address will not be published. Required fields are marked *

I accept the Privacy Policy

This site uses Akismet to reduce spam. Learn how your comment data is processed.